According to E-Waste (Management) Rules, 2016 an e-waste means electrical and electronic equipment, whole or in part discarded as waste by the consumer or bulk consumer as well as rejects from manufacturing, refurbishment and repair processes.
What is an EPR in E-Waste Management?
According to E-Waste (Management) Rules, 2016 Extended Producer Responsibility’ means responsibility of any producer of electrical or electronic equipment, for channelization of e-waste to ensure environmentally sound management of such waste. Extended Producer Responsibility may comprise of implementing take back system or setting up of collection centers or both and having agreed arrangements with authorized dismantler or recycler either individually or collectively through a Producer Responsibility Organization recognized by producer.
Who needs an EPR in E-Waste Management?
Every producer, manufacturer, refurbisher, dismantler or recycler of electrical and electronic equipment has to obtain a registration from the State Pollution Control Board or the Pollution Control Committee of the Union Territory concerned.
The E-Waste rules apply to every manufacturer, producer, consumer, bulk consumer, collection centres, dealers, e-retailer, refurbisher, dismantler and recycler involved in manufacture, sale, transfer, purchase, collection, storage and processing of e-waste or electrical and electronic equipment listed in Schedule I, including their components, consumables, parts and spares which make the product operational but shall not apply to -
(a) used lead acid batteries as covered under the Batteries (Management and Handling) Rules, 2001 made under the Act;
(b) micro enterprises as defined in the Micro, Small and Medium Enterprises Development Act, 2006 (27 of 2006); and
(c) radio-active wastes as covered under the provisions of the Atomic Energy Act, 1962 (33 of 1962) and rules made there under.
Documents Required for E-Waste Management Authorization
Categories of Electrical and Electronic Equipment Including Their Components, Consumables, Parts and Spares Covered Under the Rules
Categories of electrical and electronic equipment
Information technology and telecommunication equipment :
Centralised data processing: Mainframes, Minicomputers
Personal Computing: Personal Computers (Central Processing Unit with input and output devices)
Personal Computing: Laptop Computers(Central Processing Unit with input and output devices)
Personal Computing: Notebook Computers
Personal Computing: Notepad Computers
Printers including cartridges
Electrical and electronic typewriters
User terminals and systems
Consumer electrical and electronics:
Television sets (including sets based on (Liquid Crystal Display and Light Emitting Diode technology)
Air-conditioners excluding centralised air conditioning plants
Fluorescent and other Mercury containing lamps
Targets for Extended Producer Responsibility - Authorization
E-Waste Collection Target (Number/Weight)
During first two year of implementation of rules
30% of the quantity of waste generation as indicated in Extended Producer Responsibility Plan.
During third and fourth years of implementation of rules
40% of the quantity of waste generation as indicated in Extended Producer Responsibility Plan.
During Fifth and Sixth years of implementation of rules
50% of the quantity of waste generation as indicated in Extended Producer Responsibility Plan.
Seventh year onward of implementation of rules
70% of the quantity of waste generation as indicated in Extended Producer Responsibility Plan.
Applications Which are Exempted From the Requirements of Sub-rule (1) of rule 16
1. Mercury in single capped (compact) fluorescent lamps not exceeding (per burner):
1.1. For general lighting purposes <30 W : 2.5 mg
1.2. For general lighting purposes ≥ 30 W and <50 W : 3.5mg
1.3. For general lighting purposes ≥ 50 W and <150 W : 5mg
1.4. For general lighting purposes ≥150 W : 15 mg
1.5. For general lighting purposes with circular or square structural shape and tube diameter ≤17 mm : 7mg
1.6. For special purposes:5 mg
2.1 Mercury in double-capped linear fluorescent lamps for general lighting purposes not exceeding (per lamp):
2.1.1. Tri-band phosphor with normal life time and a tube diameter < 9mm (e.g.T2): 4mg
2.1.2. Tri-band phosphor with normal life time and a tube diameter ≥ 9 mm and ≤ 17 mm (e.g. T5): 3 mg
2.1.3. Tri- band phosphor with normal life time and a tube diameter >17 mm and ≤ 28 mm(e.g. T8): 3.5 mg
2.1.4. Tri-band phosphor with normal life time and a tube diameter >28 mm (e.g. T 12):3.5 mg
2.1.5. Tri-band phosphor with long life time (≥25000 h):5mg
2.2. Mercury in other fluorescent lamps not exceeding(per lamp):
2.2.1. Linear halophosphate lamps with tube >28 mm (e.g. T 10 and T12):10 mg
2.2.2. Non-linear halophosphate lamps(all diameters):15mg
2.2.3. Non-linear tri-band phosphor lamps with tube diameter >17 mm(e.g.T9): 15 mg
2.2.4. Lamps for other general lighting and special purposes (e.g. induction lamps):15mg
3. Mercury in cold cathode fluorescent lamps and external electrode fluorescent lamps (CCFL and EEFL) for special purposes not exceeding (per lamp):
3.1. Short length( < 500 mm):3.5mg
3.2. Medium length(>500 mm and<1500 mm): 5mg
3.3. Long length(>1500 mm): 13mg
4.1. Mercury in other low pressure discharge lamps (per lamp): 15mg
4.2. Mercury in High Pressure Sodium(vapour) lamps for general lighting purposes not exceeding (per burner)in lamps with improved colour rendering index Ra>60:
4.2.1 P ≤155 W : 30 mg
4.2.2 155 W < P <405 W : 40 mg
4.2.3. P >405 W: 40 mg
4.3. Mercury in other High Pressure Sodium(vapour)lamps for general lighting purposes not exceeding (per burner):
4.3.1 P<155 W:25mg
4.3.2. 155 W < P <405 W : 40 mg
4.4. P >405 W: 40 mg
4.4.1. Mercury in other High Pressure Sodium (vapour) lamps for general lighting purposes not exceeding (per burner):
4.4.2. P<155 W:25mg
4.4.3. 155 W < P < 405 W:30 mg
4.4.4. P >405 W:40 mg
4.5. Mercury in High Pressure Mercury (vapour) lamps (HPMV)
4.6. Mercury in metal halide lamps (MH)
4.7. Mercury in other discharge lamps for special purposes not specifically mentioned in this Schedule
5.1. Lead in glass of cathode ray tubes
5.2. Lead in glass of fluorescent tubes not exceeding 0.2% by weight
6.1. Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight
6.2. Lead as an alloying element in aluminium containing up to 0.4% lead by weight
6.3. Copper alloy containing up to 4% lead by weight
7.1. Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead)
7.2. Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission, and network management for telecommunications
7.2.1 Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound.
7.2.2 Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher
7.2.3 Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC
8.1 Cadmium and its compounds in one shot pellet type thermal cut-offs
8.2 Cadmium and its compounds in electrical contracts
9 Hexavalent chromium as an anticorrosion agent of the carbon steel cooling system in absorption refrigerators up to 0.75% by weight in the cooling solution
9.1 Lead in bearing shells and bushes for refrigerant-containing compressors for heating, ventilation, air conditioning and refrigeration (HVACR) application.
11. Lead used in C-press compliant pin connector systems
11.1 Lead used in other than C-press compliant pin connector systems
12 Lead as a coating material for the thermal conduction module C- ring
13 Lead in white glasses used for optical applications
13.1. Cadmium and lead in filter glasses and glasses used for reflectance standards.
14 Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight
15 Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages.
16 Lead in linear incandescent lamps with silicate coated tubes
17 Lead halide as radiant agent in high intensity discharge (HID) lamps used for professional reprography applications.
18 Lead as activator in the fluorescent powder (1% lead by weight or less) of discharge lamps when used as specialty lamps for diazoprinting reprography, lithography, insect traps, photochemical and curing processes containing phosphors such as SMS ((Sr, Ba)2Mg Si2O7:Pb)
18.1 Lead as activator in the fluorescent powder (1% lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphors such as BSP (Ba Si2O5:Pb)
19 Lead with PbBiSn-Hg and PblnSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact energy saving lamps (ESL)
20 Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for Liquid Crystal Displays (LCDs)
21 Lead and cadmium in printing inks for the application of enamels on glasses, such as borosilicate and soda lime glasses
23 Lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm and less
24 Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors
25 Lead oxide in surface conduction electron emitter displays (SED) used in structural elements, notably in the seal frit and frit ring.
26 Lead oxide in the glass envelope of black light blue lamps
27 Lead alloys as solder for transducers used in high-powered (designated to operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakers
29 Lead bound in crystal glass
30 Cadmium alloys as electrical/mechanical solder joints to electrical conductors located directly on the voice coil in transducers used in high-powered loudspeakers with sound pressure levels of 100 dB(A) and more
31 Lead in soldering materials in mercury free flat fluorescent lamps (which e.g. are used for liquid crystal displays, design or industrial lighting)
32 Lead oxide in seal frit used for making window assemblies for Argon and Krypton laser tubes
33 Lead in solders for the soldering of thin copper wires of 100 μm diameter and less in power transformers
34 Lead in cermet-based trimmer potentiometer elements
36 Mercury used as a cathode sputtering inhibitor in DC plasma displays with a content up to 30 mg per display
37 Lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body
38 Cadmium and cadmium oxide in thick film pastes used on aluminium bonded beryllium oxide
39 Cadmium in colour converting II-VI LEDs (<10 μg Cd per mm2of lightemitting area) for use in solid state illumination or display systems.
How to get EPR in E-waste Managemrnt Authorization?
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