In a significant boost to India's semiconductor industry, the Union Cabinet led by Prime Minister Narendra Modi has approved four new Semiconductor projects under the India Semiconductor Mission (ISM) scheme with a joint investment of approximately Rs. 4,600 crore (US$ 525 million). These new projects bring the total approved investments under ISM to Rs. 1.60 lakh crore (US$ 18.26 billion) across six states.
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The new facility, which will be established by SiCSem, Continental Device India Pvt Ltd (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) technologies, are expected to employ more than 2,000 highly skilled workers and generate several indirect employment opportunities. These projects are poised to fortify the domestic electronic manufacturing ecosystem and strengthen India’s push for self-reliance under the “Atmanirbhar Bharat” initiative.
Four Cutting-Edge Semiconductor Projects Approved Across Three States
SiCSem and 3D Glass Solutions Inc. will set up thier manufacturing units in Info Valley, Bhubaneswar, and Odisha. SiCSem, in collaboration with UK’s Clas-SiC Wafer Fab Ltd., plans to build India’s first commercial Silicon Carbide (SiC) based composite semiconductor fab with a capacity of 60,000 wafers per annum. Meanwhile, 3D Glass Solutions Inc. will launch an advanced packaging and embedded glass substrate unit, which will bring next-generation semiconductor packaging technology to India.
Continental Devices India Pvt Ltd (CDIL) will expand its separate semiconductor manufacturing in Mohali, Punjab, aiming to upsurge its annual output to 158.38 million units. At the same time, ASIP Technologies will set up a new manufacturing unit in Andhra Pradesh through a technology tie-up with South Korea’s APACT Company Ltd., with a targeted capacity of 96 million units per annum.
Impact on Key Sectors and India's Semiconductor Ecosystem
The Semiconductor products manufactured by these units serve critical sectors including telecom, automotive, defence, electric vehicles (EV), renewable energy, consumer electronics, and data centers. The development of India’s first compound semiconductor fab and advanced glass substrate packaging unit marks a noteworthy milestone, adding to the country’s capacity in high-tech semiconductor manufacturing.
These measures would not only meet growing domestic demand but also mitigate dependence on imports, thus supporting the government’s vision of building a flexible, self-sufficient semiconductor industry.
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